Thermally enhanced electrically insulative adhesive paste

Details Thermally enhanced electrically insulative adhesive paste Thermally enhanced electrically insulative adhesive paste

2011-03-15

2011-03-15

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C257S713000, C257SE21505, C523S210000

Reexamination Certificate

active

07906373

ABSTRACT:
Adhesive paste of polymer resin, fugitive liquid and particulate filler with round edges provides improved performance characteristics.

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