Thermally enhanced component substrate: thermal bar

Details Thermally enhanced component substrate: thermal bar Thermally enhanced component substrate: thermal bar

2005-10-11

2005-10-11

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S252000, C257S713000, C361S719000, C361S720000

Reexamination Certificate

active

06954360

ABSTRACT:
An IC package dissipates thermal energy using thermal bars. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal bars radiate outwardly from the die pad area and extend to the edge of the substrate component to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

REFERENCES:
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5710459 (1998-01-01), Teng et al.
patent: 5741729 (1998-04-01), Selna
patent: 6212076 (2001-04-01), MacQuarrie et al.
patent: 6282094 (2001-08-01), Lo et al.
patent: 6483187 (2002-11-01), Chao et al.
patent: 6525942 (2003-02-01), Huang et al.
patent: 6657864 (2003-12-01), Dyckman et al.
patent: 6882537 (2005-04-01), Barcley

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