Thermally enhanced compact reformer

Chemical apparatus and process disinfecting – deodorizing – preser – Chemical reactor – Including solid – extended surface – fluid contact reaction...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

481277, 481279, 481982, 481988, B01J 1200

Patent

active

058583149

ABSTRACT:
A natural gas reformer comprising a stack of thermally conducting plates interspersed with catalyst plates and provided with internal or external manifolds for reactants. The catalyst plate is in intimate thermal contact with the conducting plates so that its temperature closely tracks the temperature of the thermally conducting plate, which can be designed to attain a near isothermal state in-plane to the plate. One or more catalysts may be used, distributed along the flow direction, in-plane to the thermally conducting plate, in a variety of optional embodiments. The reformer may be operated as a steam reformer or as a partial oxidation reformer. When operated as a steam reformer, thermal energy for the (endothermic) steam reforming reaction is provided externally by radiation and/or conduction to the thermally conducting plates. This produces carbon monoxide, hydrogen, steam and carbon dioxide. When operated as a partial oxidation reformer, a fraction of the natural gas is oxidized assisted by the presence of a combustion catalyst and reforming catalyst. This produces carbon monoxide, hydrogen, steam and carbon dioxide. Because of the intimate thermal contact between the catalyst plate and the conducting plates, no excessive temperature can develop within the stack assembly. Details of the plate design may be varied to accommodate a variety of manifolding embodiments providing one or more inlets and exit ports for introducing, pre-heating and exhaust the reactants.

REFERENCES:
patent: 1452145 (1923-04-01), Cederberg
patent: 2127561 (1938-08-01), Herrmann
patent: 4174954 (1979-11-01), Kusebauch et al.
patent: 4490445 (1984-12-01), Hsu
patent: 4614628 (1986-09-01), Hsu et al.
patent: 4629537 (1986-12-01), Hsu
patent: 4721556 (1988-01-01), Hsu
patent: 4770955 (1988-09-01), Ruhl
patent: 4789561 (1988-12-01), Schaefer et al.
patent: 4812329 (1989-03-01), Isenberg
patent: 4853100 (1989-08-01), Hsu
patent: 4921680 (1990-05-01), Bonk et al.
patent: 5015444 (1991-05-01), Koga et al.
patent: 5021304 (1991-06-01), Ruka et al.
patent: 5039510 (1991-08-01), Pinto
patent: 5073405 (1991-12-01), Vasilow et al.
patent: 5080689 (1992-01-01), Pal et al.
patent: 5085742 (1992-02-01), Dollard et al.
patent: 5180561 (1993-01-01), Morishima et al.
patent: 5324452 (1994-06-01), Allam et al.
patent: 5338622 (1994-08-01), Hsu et al.
patent: 5346779 (1994-09-01), Nakazawa
patent: 5366819 (1994-11-01), Hartvigsen et al.
patent: 5397656 (1995-03-01), Morimoto et al.
patent: 5401589 (1995-03-01), Palmer et al.
patent: 5458857 (1995-10-01), Collins et al.
patent: 5462817 (1995-10-01), Hsu
patent: 5470670 (1995-11-01), Yasumoto et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermally enhanced compact reformer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally enhanced compact reformer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally enhanced compact reformer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1511601

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.