Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1995-02-06
1997-07-22
Ledynh, Bot L.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
174 522, 361709, 361714, 361743, 361718, 361760, 361761, 361772, 257698, 257700, 257704, 257706, 257707, 257720, 257734, 257779, 257787, H01L 2302, H01L 2328, H05K 720, H05K 118
Patent
active
056505930
ABSTRACT:
A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a heat sink to either the top or bottom thereof with solder. A casing is further formed on the substrate outwardly of the aperture and the heat sink mounted thereacross, the casing being comprised of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted to the heat sink secured therein.
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Castro Abram M.
Maslakow William H.
McMillan John R.
Amkor Electronics, Inc.
Ledynh Bot L.
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