Thermally enhanced ball grid array package

Details Thermally enhanced ball grid array package Thermally enhanced ball grid array package

1995-06-07

1996-11-05

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 257724, 361764, 361784, 439 83, H05K 720

Patent

active

055724051

ABSTRACT:
A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.

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Bielick et al, "Heat Spreader for Tape Ball Grid Array and Plastic Ball Grid Array Rework", IBM Tech Disclosure Bulletin, vol. 37, No., 06B, Jun. 1994.

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