Thermally enhanced ball grid array package

Details Thermally enhanced ball grid array package Thermally enhanced ball grid array package

1996-11-04

1998-06-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

257706, 257707, H05K 334

Patent

active

057687749

ABSTRACT:
A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.

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Bielick et al, "Heat Spreader for Tape Ball Grid Array and Plastic Ball Grid Array Rework", IBM Tech Disclosure Bulletin, vol. 37, No., 06B, Jun. 1994.

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