Thermally efficient power device package

Details Thermally efficient power device package Thermally efficient power device package

1988-05-11

1990-03-06

Gonzalez, Frank

357 80, H01L 2302, H01L 3902

Patent

active

049070673

ABSTRACT:
A hermetic semiconductor device package is disclosed which is capable of handling high power devices in an electrically and thermally efficient manner. The package includes a dielectric substrate with cutouts for die mount and/or bonding to a plurality of thermally and electrically conductive plates which are electrically isolated from each other.

REFERENCES:
patent: 3025437 (1962-03-01), Namen et al.
patent: 4698662 (1987-10-01), Young et al.
patent: 4703339 (1987-10-01), Matsuo

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