Metal fusion bonding – With means to cool work or product
Patent
1987-01-23
1989-02-21
Ramsey, Kenneth J.
Metal fusion bonding
With means to cool work or product
219230, 228 51, B23K 302
Patent
active
048058289
ABSTRACT:
A method and apparatus for manufacture and repair of thermally durable surface mounted device printed wiring assemblies which includes a printed wiring assembly having surface mounted devices thereon, which are attached to said wiring assembly by a quenched or rapidly soldified soldier joint. A method for manufacture and repair of such printed wiring assemblies is to heat the TWAs with SMDs thereon, above the solder melting temperature, and then expose the solder to a fluid below the solder melting temperature which is capable of absorbing heat rapidly from the solder. The intermediate solder joint is thereby rapidly solidified to achieve the advantages of the investive method. The apparatuses disclosed for manufacturing and repairing TWAs include devices capable of heating a solder joint above its melting point, and exposing said solder joint to a fluid having a temperature below the solder melting point, and further capable of absorbing heat rapidly from the molten solder, thereby allowing for a rapid soldification of the solder joint. There is further disclosed apparatuses for exposing the solder joint to a fluid which include sprayers and a liquid bath.
REFERENCES:
patent: 2068728 (1937-01-01), Amos
patent: 3292240 (1966-12-01), McNutt et al.
patent: 3436818 (1969-04-01), Merrin et al.
patent: 3866307 (1975-02-01), Pfahl et al.
patent: 4032033 (1977-06-01), Chu et al.
patent: 4077467 (1978-03-01), Spigarelli
patent: 4115601 (1978-09-01), Ammann et al.
patent: 4332342 (1982-06-01), Van Der Put
patent: 4361967 (1982-12-01), Bahnsen et al.
patent: 4612712 (1986-09-01), Pescatore et al.
patent: 4679721 (1987-07-01), Kondo
"Some Fatigue Properties of Solders and Solder Joints" by R. N. Wild, Jan. 1973, IBM Publication #732 Z000421, IBM Federal Systems Division Electronics Systems Center, Owego, N.Y.
"Rapidly Solidified Solder Foil for Die Attachment Application" by K. S. Tan and D. Rose, Apr. 1986, Solid State Technology.
Donaldson Jay W.
Rooks Howard B.
Witherell Donald R.
Hamann H. Fredrick
Murrah M. Lee
Ramsey Kenneth J.
Rockwell International Corporation
Williams Gregory G.
LandOfFree
Thermally durable surface mounted device printed wiring assembli does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermally durable surface mounted device printed wiring assembli, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally durable surface mounted device printed wiring assembli will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1517045