Thermally dissipated soldering flux

Details Thermally dissipated soldering flux Thermally dissipated soldering flux

1989-12-12

1991-04-02

Rosenberg, Peter D.

Metal treatment

Compositions

B23K 3435

Patent

active

050045083

ABSTRACT:
A no clean thermally dissipated soldering flux is shown which includes camphor as a flux base, an organic activator and an organic diluent. The camphor provides a tacky yet fluid medium which is thermally dissipated during the flux operation and leaves no undesirable residue which would require a postcleaning step.

REFERENCES:
patent: 3003901 (1961-10-01), Marcell
patent: 3127290 (1964-03-01), Konig
patent: 3796610 (1974-03-01), Sarnachi
patent: 3944123 (1976-03-01), Jacobs
patent: 4168996 (1979-09-01), Zado
patent: 4278479 (1981-07-01), Anderson et al.
patent: 4661173 (1987-04-01), Barajas et al.
patent: 4738732 (1988-04-01), Anderson et al.
patent: 4752027 (1988-06-01), Gschwend
J. Lamoureux, C. Morand and B. Pottier, "Used Electronic Module Pin Solder Dress Process", IBM Technical Disclosure Bulletin, vol. 24, No. 10, Mar. 1982.

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