Radiation imagery chemistry: process – composition – or product th – Thermographic process – Heat applied after imaging
Reexamination Certificate
2006-06-27
2006-06-27
Schilling, Richard L. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Thermographic process
Heat applied after imaging
C430S527000, C430S530000, C430S618000, C430S619000
Reexamination Certificate
active
07067242
ABSTRACT:
Backside conductive layers with increased conductive efficiency can be provided for thermally developable materials by formulating hydrophilic metal oxide clusters in a hydrophobic environment using low shear mixing conditions. The dry thickness and coating weight of the conductive layer are thereby reduced.
REFERENCES:
patent: 5340676 (1994-08-01), Anderson et al.
patent: 5368995 (1994-11-01), Christian et al.
patent: 5457013 (1995-10-01), Christian et al.
patent: 5731119 (1998-03-01), Eichorst et al.
patent: 6355405 (2002-03-01), Ludemann et al.
patent: 6464413 (2002-10-01), Oyamada
patent: 6641989 (2003-11-01), Sasaki et al.
patent: 6689546 (2004-02-01), LaBelle et al.
patent: 1 057 621 (2000-12-01), None
U.S. Appl. No. 10/930,428 (D-88160) filed Aug. 31, 2004 tiledThermally Developable Materials With Backside Conductive Layerby T.J. Ludemann et al.
U.S. Appl. No. 10/930,438 (Docket 88245) filed Aug. 31, 2004 titledImproved Antistatic Properties For Thermally Developable Materialsby T.J. Ludemann et al.
“Preparation of Electrically Conductive and Transparent Film on CRT Panel” (paper #495) by Young-Sang Cho et al.
The Structure Formation of Nanoparticles During Coating and Dryingby Y. Yamaguchi et al, 12th Intern'l Coating Sci. and Tech. Sym., Rochester, NY Sep. 19-22, 2004, pp. 186-189.
Chen Samuel
Koestner Roland J.
LaBelle Gary E.
Ludemann Thomas J.
Eastman Kodak Company
Leichter Louis M.
Schilling Richard L.
Tucker J. Lanny
LandOfFree
Thermally developable materials with improved conductive layer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermally developable materials with improved conductive layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally developable materials with improved conductive layer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3648668