Thermally developable materials with buried conductive...

Details Thermally developable materials with buried conductive... Thermally developable materials with buried conductive...

2007-08-21

2007-08-21

Chea, Thorl (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Thermographic process

Heat applied after imaging

C430S523000, C430S527000, C430S529000, C430S530000, C430S631000

Reexamination Certificate

active

11403438

ABSTRACT:
Thermally developable materials including photothermographic and thermographic materials having a buried conductive backside layer comprising one or more binder polymers, and an antistatic compound that is an organic solvent soluble alkali metal salt of any of a perfluorinated aliphatic carboxylic acid having 2 or 3 carbon atoms, a perfluorinated aliphatic sulfonate, or a tetrafluoroborate, provide antistatic coatings that exhibit little dependence on humidity.

REFERENCES:
patent: 4582781 (1986-04-01), Chen et al.
patent: 5674671 (1997-10-01), Brandon et al.
patent: 6132950 (2000-10-01), Ishigaki et al.
patent: 6171707 (2001-01-01), Gomez et al.
patent: 6287754 (2001-09-01), Melpolder et al.
patent: 6689546 (2004-02-01), LaBelle et al.
patent: 6699648 (2004-03-01), Sakizadeh et al.
patent: 6811724 (2004-11-01), Majumdar et al.
patent: 2005/0006629 (2005-01-01), Majumdar et al.
patent: 2005/0099654 (2005-04-01), None

Affiliated with

Also associated with

Rating

Thermally developable materials with buried conductive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally developable materials with buried conductive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally developable materials with buried conductive... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3898547