Thermally developable materials having improved backside...

Details Thermally developable materials having improved backside... Thermally developable materials having improved backside...

2006-04-04

2006-04-04

Schilling, Richard L. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Thermographic process

Heat applied after imaging

C430S527000, C430S530000, C430S618000, C430S619000

Reexamination Certificate

active

07022467

ABSTRACT:
Backside conductive layers with increased conductive efficiency can be provided for thermally developable materials by providing a buried conductive coating containing a lower molecular weight polyvinyl acetal binder (that is, a molecular weight of at least 8,000 and less than 30,000).

REFERENCES:
patent: 6355405 (2002-03-01), Ludemann et al.
patent: 6464413 (2002-10-01), Oyamada
patent: 6641989 (2003-11-01), Sasaki et al.
patent: 6689546 (2004-02-01), LaBelle et al.
patent: 2004/0198602 (2004-10-01), Pham
patent: 2004-279500 (2004-10-01), None
U.S. Appl. No. 10/930,428, titled “Thermally Developable Materials With Backside Conductive Layer ”by T.J. Ludemann et al., filed Aug. 31, 2004.
U.S. Appl. No. 10/930,438, titled “Improved Antistatic Properties For Thermally Developable Materials” by T.J. Ludemann et al., filed Aug. 31, 2004.
U.S. Appl. No. 10/978,205, titled “Thermally Developable Materials With Improved Conductive Layer” by T.J. Ludemann et al., filed Oct. 29, 2004.

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