Thermally deposited portion structure of thermoplastic resin...

Electric heating – Heating devices – Combined with diverse-type art device

Reexamination Certificate

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C219S544000, C156S273900, C156S274200

Reexamination Certificate

active

06211492

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to the structure of a thermally deposited portion for applying a heating element, heated by the impression of voltage, to the facing deposited portions of thermoplastic resin molded product to be deposited, melting, depositing and bonding the resin of the deposited portion by its heat generation.
BACKGROUND OF THE INVENTION
As a bonding method in the case of bonding the mutual molded products that are molded with the thermoplastic resin, it is publicly known that where the heating element is based on the electric resistance (hereinafter to be called resistance heating element) is caught or applied between the deposited portions, the voltage is impressed to the resistance heating element for its heating while pressure is applied with an adequate force, melting the resin of deposited portion with its heat, and then stopping the voltage to cool it down, thereby hardening the molten resin for depositing both the molded products with each other.
This deposition method can join the products within a shorter time than the method of using a bonding agent, the method of using an ultrasonic wave and the method of using high frequency electromagnetic induction, and the deposition method is an excellent method that can be put into practice with less of installation investment.
On the one hand, in case of using the bonding agent, a time is needed until the fixation, and the bonding agent becomes the cause for stain due to its ooze-out from the deposited portion. Further, in the case of using the supersonic wave and the high frequency induction, there is the fear of influencing the electronic parts if, for example, the electronic circuits are incorporated inside, a still greater installation is needed and causing much cost for that reason. In addition, the harmful influence on the working environment is also imaginable.
As described above, the thermal deposition method using the resistance heating element is an excellent deposition method, but the shape (structure and size) of the deposited portion to which the resistance heating element is mounted is crucial as the important factor of the deposition method.
For example, if the mounted porting is plane, the mounted position of resistance heating element can not be set up, and when the voltage is impressed, the resistance heating element is swollen by the heat generation temperature. For this reason, the resistance heating element gets out of the desired position, and the molten resin flows out to the other areas, and as a result a thin deposition layer is formed and therefore there is such a case that a satisfactory deposition strength can not be obtained.
Furthermore, in case of providing an annular groove to which the resistance heating element is mounted, the position of resistance heating element gets deviated if the width of annular groove should be too wide, the length of the annular rib to be fitted into the annular groove is short and the sufficient molten resin can not be obtained, which becomes the cause for not reaching a deposition strength that can be satisfied.
SUMMARY AND OBJECTS OF THE INVENTION
It is the primary object of this invention to present the thermal deposition structure that can obtain the satisfied deposition strength in the shape and size of the deposited portion when thermally depositing the thermoplastic resin molded products using the resistance heating element.
According to the invention, a thermally deposited portion structure of thermoplastic resin molded product is provided wherein the dimensions of deposited portions have been set in such a manner as:
(a) the interval L of both the walls in the annular groove may become 1.3 D≦L≦1.6 D;
(b) the wall thickness T of annular rib may become 1.1 D≦T≦1.2 D;
(c) the height A of outside lateral wall in the annular groove may become A≧2 D;
(d) the height B of inside lateral wall in the annular groove may become B≧2 D; and
(e) the height H of annular rib may become H≧A if the annular groove for fixing the said heating element should be provided to the periphery of deposited portion of molded product on one hand, the annular rib being fitted into the annular groove should be provided so as to protrude to the deposited portion of molded product on the other hand and the diameter of the heating element should be considered to be D, in the structure of thermally deposited portion for catching in periphery the circular cross sectional heating element being heated by the voltage impression between the circular deposited portions opposing to the thermoplastic resin molded product in object of the thermal deposition, for melting the resin of deposited portion by the heat generation of this heating element and for depositing and bonding the opposite deposited portions.
According to another aspect of the invention, a thermally deposited portion structure of thermoplastic resin molded product is provided wherein the dimensions of deposited portion has been set in such a manner that:
(a) the interval L between both the lateral walls in the annular groove may become 1.3X≦L≦1.6X;
(b) the wall thickness T of annular rib may become 1.1X≦T≦1.2X;
(c) the height A of outside lateral wall in annular groove may become A≧2Y
(d) the height B of inside lateral wall in annular groove may become B≧2Y
(e) the height H of annular rib may become H≧A if the annular groove for fixing the heating element has been installed to the periphery of deposited portion of molded product on one hand and the annular rib being fitted into the annular groove has been protrusive installed to the deposited portion of molded product on the other hand and the diagonal length or opposite side length in parallel with the annular groove bottom face of the heating element should be considered to be X and the diagonal length or opposite side length in perpendicular direction to the annular groove should be considered to be Y, in the structure of thermally deposited portion for catching in periphery the heating element whose cross section is square or polygon being heated by the voltage impression between the peripheral deposited portions opposite to the thermoplastic resin molded product in object of the thermal deposition, and for melting the resin of deposited portion by the heat generation of this heating element and depositing and bonding the opposite deposited portions.
As a result of study for many years, the inventors have found out that the best thermal deposition can be obtained by forming the portion which engages a resistance heating element to have an appropriate shape in the thermoplastic resin molded product, and moreover by defining the shape and size in relation to the width size of the resistance heating element. This succeeded in allowing an easy determination of each shape and each size, wherein this was decided after repeating the test over several times.
For example, the lateral walls are arranged in parallel on both the sides of the resistance heating element and the mounting position can be regulated by forming the annular groove fixing the resistance heating element on one side deposited portion of opposite thermoplastic resin molded product to be deposited.
The invention also brings such an effect that the resin, in a molten state by the heat generation of resistance heating element, is prevented from flowing out to the other areas and the deposition layer will not become thin. Further, the protrusive annular rib can be formed around the deposited portion of molded product on the other side.
During the deposition, both the lateral walls become the guide and fit into the said annular groove, heating the resistance heating element while pressing the upper case against the lower case with an adequate pressure, and the resin in the annular groove and the resin in the annular rib reach a molten state with the heat and get mutually mixed. Thereafter if the resins are cooled down, the deposition layer where the desired deposition strength can be obtained can be formed. As the premise is thermally deposited

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