Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate
Patent
1993-07-19
1995-03-07
Foelak, Morton
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From phenol, phenol ether, or inorganic phenolate
528119, 528 88, 528102, 528103, 528106, 528111, 528121, C08G 5900
Patent
active
053959116
ABSTRACT:
A thermally curable mixture contains 10-70% by weight of reactive compounds, 0.05-2% by weight of at least one basic catalyst, and at least one solvent. The reactive compounds are consisting essentially of a first reactive compound and a second reactive compound at a molar ratio between 1:1 and 1:10. The first reactive compound is a formamide selected from the group consisting of hydroxyformamides, di-formamides and polyformamides, and the second reactive compound is at least one compound having an epoxy equivalent between 100 and 800 g KOH per mole epoxy group, selected from a group of aromatic di-glycidylethers and aromatic poly-glycidylethers. The basic catalyst is at least one chemical agent selected from the group consisting of tertiary ammonium salts, tertiary aromatic amines, and tertiary heterocyclic amines. The solvent is at least one chemical compound selected from the group consisting of aliphatic alcohols, ether alcohols, diether, and tertiary amides.
REFERENCES:
patent: 3538050 (1970-11-01), Henderson
patent: 4203900 (1980-05-01), Kaiser
patent: 4383103 (1983-05-01), Kluger
patent: 4480082 (1984-10-01), McLean et al.
patent: 4510326 (1985-04-01), Lambert, Jr. et al.
patent: 4533719 (1985-08-01), Waddill
patent: 4632965 (1986-12-01), Hefner, Jr.
patent: 4668757 (1987-05-01), Nichols
patent: 4833204 (1989-05-01), Yusa et al.
patent: 5066684 (1991-11-01), LeMay
WPIL, File Supplier, AN-89-030019, Derwent Publications Ltd., London, GB; & JP-A-63 305 969 (Hitachi Chemical K.K.) 13 Dec. 1988.
Patent Abstracts of Japan, vol. 6, No. 219 (C-132)(1097), 2nd Nov. 1982; & JP-A-57 121 026 (Tokyo Chibaura Denki) 28 Jul. 1992,
Derwent-Abstract 87-230 816/33 (JP 62 153 316), Dec. 27, 1985.
Derwent-Abstract 86-004 352/01 (JP 60 231 723), Mar. 29, 1984.
Derwent-Abstract 75 104 E/36 (JP 57 121 025), Jan. 20, 1981.
Derwent-Abstract 75 105 E/36 (JP 57 121 026), Jan. 21, 1981.
J. Chem. Soc. 1948, p. 1457.
Barkdoll, A. E. et al; J. Amer. Chem. Soc. 73, pp. 741-746 (1951).
Frings Rainer B.
Grahe Gerwald F.
Dainippon Ink and Chemicals Inc.
Foelak Morton
Jones Richard
LandOfFree
Thermally curable mixture containing epoxy and formamide compoun does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermally curable mixture containing epoxy and formamide compoun, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally curable mixture containing epoxy and formamide compoun will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1406799