Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2011-06-21
2011-06-21
Woodward, Ana L (Department: 1765)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C525S207000, C525S217000, C525S231000, C525S242000, C525S279000, C525S282000, C525S293000
Reexamination Certificate
active
07964671
ABSTRACT:
The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant.
REFERENCES:
patent: 6100334 (2000-08-01), Abdou-Sabet
Lee Woo Sung
Park Se Hoon
Park Seong Dae
Yoo Myong Jae
Korea Electronics Technology Institute
Lee Hong Degerman Kang & Waimey
Woodward Ana L
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