Thermally controlled process interface

Automatic temperature and humidity regulation – Motors – Fluid-operated

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C137S343000, C700S300000

Reexamination Certificate

active

07980481

ABSTRACT:
A field device is coupled to a process through at least one process interface element. The process interface element may be a field device flange, a manifold, or a process flange. The process interface element has a temperature sensor attached thereto, and is adapted to receive a thermal source. In one embodiment, the thermal source is one or more electrical heaters. In another embodiment, the thermal source is thermal transfer fluid tracing through the process interface element. A controller is coupled to the temperature sensor and is adapted to control the heat applied to the process interface element based upon the temperature of the process interface element measured by the temperature sensor.

REFERENCES:
patent: 4738276 (1988-04-01), Adams
patent: 5481968 (1996-01-01), Clem
patent: 5526685 (1996-06-01), Davis
patent: 5868159 (1999-02-01), Loan et al.
patent: 5932332 (1999-08-01), Pandorf et al.
patent: 6295875 (2001-10-01), Frick et al.
patent: 6510740 (2003-01-01), Behm et al.
patent: 6578596 (2003-06-01), Batchelder et al.
patent: 6591696 (2003-07-01), Bachinski
patent: 6681623 (2004-01-01), Bonne et al.
patent: 6752165 (2004-06-01), Johansson
patent: 6790034 (2004-09-01), Kearns et al.
patent: 2003/0221491 (2003-12-01), Albert et al.
patent: 2003/0234048 (2003-12-01), Shajii et al.
patent: 2005/0115945 (2005-06-01), Kesteren et al.
patent: 1219710 (1971-01-01), None
patent: 55055216 (1980-04-01), None
Copy of the International Search Report and Written Opinion from application No. PCT/US2005/041871, filed Nov. 18, 2005.
Setra, “Heated 700 Series Vacuum Pressure Transducers Models 764/769/774,” http://www.setra.com/tra/pro/p—ul—700.htm, Jul. 9, 2004.
Communication issued for counterpart European Patent Application 05 84 9149.9, filed Nov. 18, 2005.
First Office Action for Chinese patent application 200580041658.6, filed Nov. 18, 2005.
Official Action from Russian patent application 2007125650, filed Nov. 18, 2005.
Second Office Action from Chinese patent application No. 200580041658.6, dated May 8, 2009.
Office Communication from European patent application No. 05 849 149.9-2206, dated May 3, 2010.
Rejection Decision from Chinese patent application No. 200580041658.6, dated May 5, 2010.
First Office Action from the Japanese patent application No. 2007-545496 dated Nov. 24, 2010.
First Examination Report from Indian patent application No. 3018/CHENP/2007 dated Dec. 28, 2010.
Communication from European patent application No. 05849149.9 dated May 11, 2011.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermally controlled process interface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally controlled process interface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally controlled process interface will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2647074

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.