Thermally controlled fluidic self-assembly

Coating processes – Nonuniform coating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C427S558000, C427S066000, C427S077000, C427S457000

Reexamination Certificate

active

07629026

ABSTRACT:
Methods and apparatuses are provided for assembling a structure on a support having a pattern of binding sites. In accordance with the method, a first fluid is provided on the surface of the support with the first fluid being of a type that that increases viscosity when heated, the first fluid having first micro-components suspended therein each adapted to engage the binding sites. The first fluid proximate to selected binding sites is heated to increase the viscosity of the responsive fluid proximate to the selected binding sites so that the first micro-components suspended in the first fluid are inhibited from engaging the selected binding sites.

REFERENCES:
patent: 5355577 (1994-10-01), Cohn
patent: 5545291 (1996-08-01), Smith et al.
patent: 5783856 (1998-07-01), Smith et al.
patent: 5824186 (1998-10-01), Smith et al.
patent: 5904545 (1999-05-01), Smith et al.
patent: 5955515 (1999-09-01), Kimura et al.
patent: 6274508 (2001-08-01), Jacobsen et al.
patent: 6300149 (2001-10-01), Smith
patent: 6417025 (2002-07-01), Gengel
patent: 6420266 (2002-07-01), Smith et al.
patent: 6468638 (2002-10-01), Jacobsen et al.
patent: 6479395 (2002-11-01), Smith et al.
patent: 6527964 (2003-03-01), Smith et al.
patent: 6536106 (2003-03-01), Jackson et al.
patent: 6555408 (2003-04-01), Jacobsen et al.
patent: 6586338 (2003-07-01), Smith et al.
patent: 6605453 (2003-08-01), Ozkan et al.
patent: 6611237 (2003-08-01), Smith
patent: 6623579 (2003-09-01), Smith et al.
patent: 7251882 (2007-08-01), Ricks et al.
patent: 2002/0005294 (2002-01-01), Mayer et al.
patent: 2002/0031813 (2002-03-01), Ozkan et al.
patent: 2002/0093396 (2002-07-01), Smith
patent: 2002/0149107 (2002-10-01), Chang et al.
patent: 2002/0153606 (2002-10-01), Gengel
patent: 2003/0068519 (2003-04-01), Brewer et al.
patent: 2003/0140317 (2003-07-01), Brewer et al.
patent: 2003/0155151 (2003-08-01), Hermanns et al.
patent: 2003/0182794 (2003-10-01), Fonstad, Jr. et al.
patent: 2003/0183904 (2003-10-01), Fonstad, Jr. et al.
patent: 2003/0186469 (2003-10-01), Fonstad, Jr. et al.
His-Jen J. Yeh and John S. Smith, “Fluidic Self-Assembly of Microstructures and Its Application to the Integration of GaAs on Si”, 1994 IEEE, 0-7803-1833-1/94, pp. 279-284, University of California.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermally controlled fluidic self-assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally controlled fluidic self-assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally controlled fluidic self-assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4083631

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.