Thermally conductive substrate, thermally conductive...

Details Thermally conductive substrate, thermally conductive... Thermally conductive substrate, thermally conductive...

2006-04-25

2006-04-25

Tran, Minhloan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S665000, C257S666000, C257S668000, C257S669000, C257S675000, C257S783000, C438S118000, C438S119000, C438S120000, C438S121000, C438S122000

Reexamination Certificate

active

07033865

ABSTRACT:
By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.

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