Thermally conductive screen mesh for encapsulated integrated cir

Details Thermally conductive screen mesh for encapsulated integrated cir Thermally conductive screen mesh for encapsulated integrated cir

1992-09-22

1994-05-03

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 174 35R, 165 803, 165185, 257659, 257796, 257660, 257713, 361816, H05K 720

Patent

active

053093216

ABSTRACT:
An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material forms a housing enclosing the chip and bonded to the screen mesh. Preferably one of the layers is exposed to the outside of the housing and the screen mesh is secured to a substrate supporting the chip.

REFERENCES:
patent: 3694699 (1972-09-01), Snyder et al.
patent: 4009752 (1977-03-01), Wilson
patent: 4244098 (1981-01-01), Barcus
patent: 4333102 (1982-06-01), Jester et al.
patent: 4356864 (1982-11-01), Ariga et al.
patent: 4407006 (1983-09-01), Holick et al.
patent: 4421161 (1983-12-01), Romania et al.
patent: 4465130 (1984-08-01), Romania et al.
patent: 4541004 (1985-09-01), Moore
patent: 4598308 (1986-07-01), James et al.
patent: 4611238 (1986-09-01), Lewis et al.
patent: 4620216 (1986-10-01), Horvarth
patent: 4624302 (1986-11-01), Hayden et al.
patent: 4682208 (1987-07-01), Ohashi et al.
patent: 4682651 (1987-07-01), Gabuzda
patent: 4715430 (1987-12-01), Arnold et al.
patent: 4721996 (1988-01-01), Tustaniwskyj et al.
patent: 4730666 (1988-03-01), Flint et al.
patent: 4750031 (1988-06-01), Miller et al.
patent: 4764804 (1988-08-01), Sahara et al.
patent: 4868349 (1989-09-01), Chia
patent: 4878108 (1989-10-01), Phelps, Jr. et al.
patent: 4888449 (1989-12-01), Crane et al.
patent: 4899210 (1990-02-01), Lorenzetti et al.
patent: 4964458 (1990-10-01), Flint et al.
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 4993482 (1991-02-01), Dolbear et al.
patent: 5006924 (1991-04-01), Frankeny et al.
patent: 5022462 (1991-06-01), Flint et al.
patent: 5057903 (1991-10-01), Olla
patent: 5070936 (1991-12-01), Carroll et al.
patent: 5083194 (1992-01-01), Bartilson
patent: 5146314 (1992-09-01), Pankove
patent: 5155579 (1992-10-01), Au Yeung
patent: 5156923 (1992-10-01), Jha et al.
patent: 5166772 (1992-11-01), Soldner et al.
Dombroski et al, "Thermal Conduction Module", IBM Technical Disclosure Bulletin, vol. 20, No. 6, Nov. 1977, pp. 2214-2215.
"Deltem.TM. Composite Heat Sinks Introduce A New Dimension to Electronics Heat Transfer", EG&G Wakefield Engineering, Product Brochure, Jun. 1989, pp. 1-4.

Affiliated with

Also associated with

Rating

Thermally conductive screen mesh for encapsulated integrated cir does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally conductive screen mesh for encapsulated integrated cir, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally conductive screen mesh for encapsulated integrated cir will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2119795