Thermally conductive organosiloxane compositions

Details Thermally conductive organosiloxane compositions Thermally conductive organosiloxane compositions

1989-02-08

1991-04-30

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524 80, 524404, 524428, 524701, 524786, 524789, C08K 328

Patent

active

050118706

ABSTRACT:
The combination of known thermally conductive fillers having an average particle size of from about 10 to about 100 microns with aluminum nitride having an average particle size of less than one micron improves the thermal conductivity of organosiloxane compositions. The thermal conductivity values achieved using this combination of fillers is higher than can be achieved using the maximum loading of either filler alone that can be present without adversely affecting the ability of the organosiloxane composition to cure or to serve as useful coatings and encapsulates for electronic solid state devices and other substrates.

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Research Disclosure No. 259,055, published Nov. 10, 1985.

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