Thermally conductive module

Details Thermally conductive module Thermally conductive module

1987-07-20

1988-04-19

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361385, 361414, 174 685, H05K 720

Patent

active

047394439

ABSTRACT:
A thermally conductive module is adapted for mounting a plurality of electronic components. A ceramic substrate has a first layer of foil glass bonded thereto and adapted for mounting a plurality of electronic components thereon. A second layer of foil is glass bonded to a second surface of the ceramic substrate and is adapted to conduct heat from the module.

REFERENCES:
patent: 4320438 (1982-03-01), Ibrahim
patent: 4381032 (1983-04-01), Cutchaw
patent: 4383270 (1983-05-01), Schelhorn
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4415025 (1983-11-01), Horvath
patent: 4491622 (1985-01-01), Butt
patent: 4589057 (1986-05-01), Short
patent: 4602318 (1986-07-01), Lassen
"Microelectrical Packaging" by Blodgett, Jr. in Scientific American, Jul. 1983, vol. 249, No. 1, pp. 86-96.
"Semiconductor Module with Improved Air Cooling" by Zirnis in IBM Technical Disclosure Bulletin, vol. 20, No. 5, Oct. 1977.
"Wafer Processing Developments" by Murray, Semiconductor International, Nov. 1985, p. 28.

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