Thermally conductive joining film

Stock material or miscellaneous articles – Structurally defined web or sheet – Including grain – strips – or filamentary elements in...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428378, 428381, 428388, 428389, B32B 512

Patent

active

056958471

ABSTRACT:
A thermally conductive film that includes a film of polymeric matrix material having a thickness t defined between a top surface and a bottom surface. A plurality of fibers, having a greater thermal conductivity than the polymeric matrix material, is disposed in the film and extends between the top surface and the bottom surface. Each of the fibers are oriented in the film to form a fiber-to-film surface angle .theta. relative to the top and bottom surfaces that is greater than about 45.degree. but is less than arctan t/d, where t is the thickness of the film and d is the diameter of the fibers in the direction of the angle .theta.. A shear/extruder apparatus is used to form the thermally conductive film from a sheet of composite prepreg material. An upper die block and a lower die block separated by a predetermined distance form an extrusion slot therebetween. A ram blade is dimensioned to intermittently insert into the input opening of the extrusion slot so that when the prepreg is positioned in front of the input opening, the prepreg is repetitively sheared by the ram blade to form sheared pieces that are forced into the extrusion slot and merged together to form the thermally conductive film with the fibers disposed therein extending substantially between the top surface and the bottom surface of the film and oriented to have the fiber-to-film surface angle .theta..

REFERENCES:
patent: H1332 (1994-07-01), Deakyne et al.
patent: 3462340 (1969-08-01), Hough
patent: 3930916 (1976-01-01), Shelley
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 4065592 (1977-12-01), McAllister
patent: 4065593 (1977-12-01), Peterson
patent: 4199637 (1980-04-01), Sado
patent: 4210895 (1980-07-01), Sado et al.
patent: 4252391 (1981-02-01), Sado
patent: 4252990 (1981-02-01), Sado
patent: 4321033 (1982-03-01), Eddy et al.
patent: 4408814 (1983-10-01), Takashi et al.
patent: 4449774 (1984-05-01), Takashi et al.
patent: 4485429 (1984-11-01), Mittal
patent: 4486490 (1984-12-01), Patz et al.
patent: 4520562 (1985-06-01), Sado et al.
patent: 4603731 (1986-08-01), Olsen
patent: 4729166 (1988-03-01), Lee et al.
patent: 4752415 (1988-06-01), Iwaskow et al.
patent: 4754546 (1988-07-01), Lee et al.
patent: 4810677 (1989-03-01), Heinze et al.
patent: 4849858 (1989-07-01), Grapes et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 4874548 (1989-10-01), Hajovsky
patent: 4882089 (1989-11-01), Iwaskow et al.
patent: 4888247 (1989-12-01), Zweben et al.
patent: 4954873 (1990-09-01), Lee et al.
patent: 4983456 (1991-01-01), Iwaskow et al.
patent: 4990402 (1991-02-01), Kneringer et al.
patent: 5002715 (1991-03-01), Grapes et al.
patent: 5026748 (1991-06-01), Adams et al.
patent: 5041183 (1991-08-01), Nakamura et al.
patent: 5077637 (1991-12-01), Martorana et al.
patent: 5111359 (1992-05-01), Montesano
patent: 5187225 (1993-02-01), Kitagawa
patent: 5218977 (1993-06-01), Takahashi
patent: 5224030 (1993-06-01), Banks et al.
patent: 5255738 (1993-10-01), Przilas
patent: 5262229 (1993-11-01), Lampert et al.
patent: 5316080 (1994-05-01), Banks et al.
patent: 5336443 (1994-08-01), Odashima
patent: 5390217 (1995-02-01), Ioki et al.
patent: 5390734 (1995-02-01), Voorhes et al.
patent: 5510748 (1996-04-01), Blackmon et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermally conductive joining film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally conductive joining film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally conductive joining film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1606017

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.