Thermally conductive interface materials and methods of using th

Details Thermally conductive interface materials and methods of using th Thermally conductive interface materials and methods of using th

1991-08-13

1993-05-25

Davis, Jenna L.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428168, 428354, 361388, 257712, B32B 310, B32B 328, H05K 720

Patent

active

052138682

ABSTRACT:
A thermally conductive interface material formed of a polymeric binder and one or more thermally fillers is disclosed. One or both of the major surfaces of the interface material has a means for removing air from between that surface and the surface to which it is attached, such as a heat sinker an electronic component. Alternatively, the heat sink or component may have the air removal means instead of or in addition to the interface material. The air removal means may be a series of embossments, channels or grooves or throughholes. Preferably, the interface is a pressure sensitive acrylic adhesive material and more preferably, it is in the form of a tape.

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