Thermally conductive interface layers

Details Thermally conductive interface layers Thermally conductive interface layers

1999-05-14

2000-12-26

Lam, Cathy F.

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Web or sheet containing structurally defined element or...

Adhesive outermost layer

4283202, 428322, 174118, 156 60, 1562722, 257675, 257687, 257701, 257702, 257706, 257707, B32B 1504

Patent

active

061656127

ABSTRACT:
An improved interface pad or layer for use in combination with solid state electronic components adapted to be interposed along a heat dissipating path between the electronic device and a mounting chassis or heat-sink surface. The interface pads comprise a polyphenylsulfone binder or matrix blended with a particulate solid such as alumina, boron nitride, graphite, silicon carbide, diamond, metal powders, and mixtures or blends thereof. Advantageous formulations include up to 45% alumina. Another advantageous formulation includes between 10% and 20% by weight of boron nitride, balance polyphenylsulfone.

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