Thermally conductive interface for electronic devices

Details Thermally conductive interface for electronic devices Thermally conductive interface for electronic devices

1996-03-18

1997-10-21

Bell, James J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428354, 428355, 428447, 428450, 4284735, 428901, B32B 712

Patent

active

056794576

ABSTRACT:
A mechanically conformable thermally conductive interface for use in electrically isolating and thermally connecting printed circuit boards to either beat sinks, metal chasses, or heat spreaders. The interface material utilizes silicone polymers of controlled molecular weight and a surface layer of a pressure sensitive adhesive may be employed. The silicone polymer is filled with a thermally conductive electrically insulative particulate such as alumina and/or boron nitride, with the silicone being prepared as a reaction product of a liquid organosiloxane together with a chain extender such as a hydride terminated polydimethylsiloxane material. A release film such as polyethylene may be utilized as the undersurface layer, if desired.

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