Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Patent
1997-04-30
2000-07-18
Nakarani, D. S.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
428355CN, 428421, 428422, 428451, 4284744, 428480, 428519, 428520, B32B 2508, B32B 2730, B32B 2732, B32B 2736
Patent
active
060904844
ABSTRACT:
A thermally conductive conformable interface layer for use in mounting electronic devices such as transistors or the like onto the surface of a chassis or heat sink. The thermally conductive interface material forms a highly conductive thermal bridge or transfer medium between the external surfaces of the electronic device and the heat sink. The thermally conductive material comprises a multi-layer laminate, typically a polymeric thermally conductive layer along with a film of adhesive bonded thereto. The polymeric layer is preferably a silicone resin, such as polydimethylsiloxane blended with a thermoplastic adhesive such as linear saturated polyester. The polydimethylsiloxane may be filled with a thermally conductive material such as graphite with an adhesive layer being utilized to attach the polymeric layer onto the device and heat sink.
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Nakarani D. S.
The Bergquist Company
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