Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Reexamination Certificate
2008-07-15
2010-11-30
Ahmed, Sheeba (Department: 1787)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
C428S500000
Reexamination Certificate
active
07842381
ABSTRACT:
Electromagnetic-energy absorbing materials are combined with thermally conductive materials, such as those used for thermal management in association with electronic equipment, thereby suppressing the transmission of electromagnetic interference (EMI) therethrough. Disclosed are materials and processes for combining EMI-absorbing materials with thermally conductive materials thereby improving EMI shielding effectiveness in an economically efficient manner. In one embodiment, a thermally conductive EMI absorber is prepared by combining an EMI-absorbing material (for example, ferrite particles) with a thermally conducting material (for example, ceramic particles), each suspended within an elastomeric matrix (for example, silicone). In application, a layer of thermally conductive EMI-absorbing material is applied between an electronic device or component, and a heat sink.
REFERENCES:
patent: 4299873 (1981-11-01), Ogihara et al.
patent: 4555422 (1985-11-01), Nakamura et al.
patent: 5632942 (1997-05-01), Yeh et al.
patent: 5817583 (1998-10-01), Alderson et al.
patent: 5827997 (1998-10-01), Chung et al.
patent: 5841067 (1998-11-01), Nakamura et al.
patent: 6090728 (2000-07-01), Yenni et al.
patent: 6852573 (2005-02-01), Ebihara et al.
patent: 6890970 (2005-05-01), Kawaguchi
patent: 7262369 (2007-08-01), English
patent: 2002/0014748 (2002-02-01), McCullough et al.
patent: 1359989 (2002-07-01), None
patent: 0945916 (1999-09-01), None
patent: 1267601 (2002-12-01), None
patent: 2001348542 (2001-12-01), None
patent: 2001358265 (2001-12-01), None
patent: 2002217342 (2002-08-01), None
patent: WO 02/13315 (2002-02-01), None
Research Progress of the Materials for Radar Absorbing Coatings, Wang Jieliang et al., Modern Paint & Finishing, Feb. 28, 2002, 4 pages.
Ahmed Sheeba
Harness & Dickey & Pierce P.L.C.
Laird Technologies Inc.
LandOfFree
Thermally conductive EMI shield does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermally conductive EMI shield, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally conductive EMI shield will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4190123