Thermally conductive, electrically insulating glued connection,

Details Thermally conductive, electrically insulating glued connection, Thermally conductive, electrically insulating glued connection,

1995-01-12

1997-12-09

Le, H. Thi

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

361742, 361746, 428329, 428331, B32B 516

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active

056958722

ABSTRACT:
A glued connection suitable for attaching high power electronic components to a mounting location, such as on a cooling element, has an electrically insulating base layer of unfilled adhesive applied onto at least one surface of the parts to be glued. An adhesive filled with an electrically insulating powder that has good thermal conductivity is applied onto at least one part surface. Grains of the powder puncture the base layer, and the thickness of the glued connection thus essentially corresponds to the size of the grains.

REFERENCES:
patent: 4307147 (1981-12-01), Ohishi et al.
patent: 4689250 (1987-08-01), Quella et al.
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5445308 (1995-08-01), Nelson et al.
Patents Abstracts of Japan, C-805, Feb. 13, 1991, vol. 15/No. 60, Japanese Application No. 64-107283.
Patents Abtracts of Japan, C-916, Mar. 3, 1992, vol. 16/No. 86, Japanese Application No. 2-72144.

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