Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-03-11
1993-12-28
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439485, 439591, 439487, H01R 909, H01R 13533
Patent
active
052734390
ABSTRACT:
A multi-chip module electrical and thermal conducting apparatus is provided. The apparatus is disposed between layers or boards of the module and includes electrical conducting traces. Electrical conductors are deposited on the faces of the layers and the traces electrically interconnect the electrical conductors of the two layers. The traces are joined to an elastomeric body and insulating material that are essentially non-conductive of electrical and thermal energy. The apparatus includes a thermal conduction unit that acts as a thermal shunt around the body and insulating material. The thermal conduction unit is electrically isolated from the traces. Thermal energy is received by the thermal conduction unit when heat is generated by the activation of electronic components mounted on the module layers. The thermal energy received by the thermal conduction unit is carried away by thermal vias formed in the module layers.
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Paurus Floyd G.
Szerlip Stanley R.
Bradley Paula A.
Storage Technology Corporation
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