Thermally conductive connection with matrix material and randoml

Details Thermally conductive connection with matrix material and randoml Thermally conductive connection with matrix material and randoml

1994-06-22

1995-08-29

Ramsey, Kenneth J.

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228175, 22818022, 361743, B23K 3526

Patent

active

054453089

ABSTRACT:
A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.

REFERENCES:
patent: 3141238 (1964-07-01), Herman, Jr.
patent: 3372310 (1968-03-01), Kanter
patent: 3395443 (1968-08-01), Polinko, Jr.
patent: 3805123 (1974-04-01), Rieger
patent: 4098452 (1978-07-01), Webster et al.
patent: 4233103 (1980-11-01), Shaheen
patent: 4299715 (1981-11-01), Whitfield et al.
patent: 4398975 (1983-08-01), Ohsawa et al.
patent: 4403410 (1983-09-01), Robinson
patent: 4410457 (1983-10-01), Fujimura et al.
patent: 4435611 (1984-03-01), Ohsawa et al.
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4448240 (1984-05-01), Sharon
patent: 4515304 (1985-05-01), Berger
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4611745 (1986-09-01), Nakahasi et al.
patent: 4732702 (1988-03-01), Yamazaki et al.
patent: 4740252 (1988-04-01), Hasegawa et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 4740830 (1988-04-01), Ketley
patent: 4744850 (1988-05-01), Imano et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4769525 (1988-09-01), Leatham
patent: 4769690 (1988-09-01), Suzuki et al.
patent: 4796157 (1989-01-01), Ostrem
patent: 4804132 (1989-02-01), DiFrancesco
patent: 4875617 (1989-10-01), Citowsky
patent: 4915167 (1990-04-01), Altoz
patent: 4929597 (1990-05-01), Takeshita et al.
patent: 4949220 (1990-08-01), Tashiro
patent: 4995546 (1991-02-01), Regnault
patent: 5012858 (1991-05-01), Natori et al.
patent: 5019201 (1991-05-01), Yabu et al.
patent: 5024264 (1991-06-01), Natori et al.
patent: 5031308 (1991-07-01), Yamashita et al.
patent: 5053195 (1991-10-01), MacKay
patent: 5056706 (1991-10-01), Dolbear et al.
patent: 5062896 (1991-11-01), Huang et al.
patent: 5123986 (1992-06-01), Sugiyama et al.
patent: 5147210 (1992-09-01), Patterson et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5183969 (1993-02-01), Odashima
patent: 5225157 (1993-07-01), McKay
patent: 5235741 (1993-08-01), Mase
patent: 5258577 (1993-11-01), Clements
patent: 5323294 (1994-06-01), Layton
patent: 5328087 (1994-07-01), Nelson et al.
Tikhomirova, et al., "Soldering Copper with Copper-Gallium Solders," Svar. Proiz., No. 10, 1967, pp. 16-18.
Harman, "Hard Gallium Alloys for Use as Low Contact Resistance Electrodes and for Bonding Thermocouples into Samples," The Review of Scientific Instruments, vol. 31, No. 7, Jul. 1960, pp. 717-720.
Tikhomirova, et al., "Effect of the Particle Shape and Size of a Second Component on the Properties of the Gallium Solders," Poroshkovaya Matallurgiya, No. 12(84), Dec. 1969, pp. 51-56.
Darveaux et al., "Thermal/Stress Analysis of a Multichip Package Design," Proceedings of the 39th Electronic Components Conference, 1989, pp. 668-671.
Nayak et al, "A High Performance Thermal Module for Computer Packaging," Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 357-364.
Hwang et al, "A Thermal Module Design for Advanced Packaging," Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 347-355.
Product Brochure entitled "Indalloy.TM. Fusible Alloys Available" by Indium Corporation of America, Utica, N.Y. (date unknown) pp. 1-5.
Product Brochure entittle "Z link.TM. Multilayer Technology" by Sheldahl, Inc., Northfield, Minn., (date unknown) pp. 1-8.
Technical Bulletin entitled "DieGlas.TM. Die Attach Material Processing Recommendations" by Alphametals, Jersey City, N.J., Feb. 1992, pp. 1-2.
Product Brochure entitled "High Performance Electronic Materials Manufactured by A. I. Technology, Inc." by A. I. Technology, Inc., Princeton, N.J. (date unknown) pp. 1-5.
P. Bujard, "Thermal Conductivity of Boron Nitride Filled Epoxy Resins: Temperature Dependence Influence of Sample Penetration", Intersociety Conference on Thermal Performance in the Fabrication and Operation of Electronic Components 1988, Los Angeles, Calif., May 11-13, 1988, pp. 41-49.
Thomas Dolbear, "Liquid Metal Paste for Thermal Connections", Proceedings of the International Electronic Packaging Society (IEPS), Sep., 1992, pp. 475-485.
"IBM Technical Disclosure Bulletin" vol. 31, No. 5, Oct. 1988, p. 34.
Hansen, Constitution of Binary Alloys, McGraw-Hill, 1958, pp. 22 & 96.
Keeler, "Liquid Interconnects For Fine Pitch Assembly?" Electronic Packaging & Production, vol. 14, Jun. 1989.
Glushkova et al, "Gallium-Copper and Gallium-Nickel Paste Solders," Svar. Proiz., No. 11, 1968, pp. 36-37.

Affiliated with

Also associated with

Rating

Thermally conductive connection with matrix material and randoml does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally conductive connection with matrix material and randoml, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally conductive connection with matrix material and randoml will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1814677