Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1989-03-22
1991-04-30
Marquis, Melvyn I.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523443, 524404, 524428, 524443, C08L 6300
Patent
active
050118722
ABSTRACT:
A thermal conductive polymer composition comprising a mixture of a polymer and a thermally conductive filler material, said filler material having a median particle size of between about 130 to 260 microns and a size distribution characterized by the formula: ##EQU1## where % represents the wt. % of the particles below or above the median particle size and M represents the median particle size in microns.
REFERENCES:
patent: 2871216 (1959-01-01), Anderson
patent: 3261800 (1966-07-01), Collins
patent: 3652491 (1972-03-01), Nelson et al.
patent: 3972821 (1976-08-01), Weidenbenner et al.
patent: 4129550 (1978-12-01), Nametkin et al.
patent: 4210774 (1980-07-01), Perry
patent: 4233077 (1980-11-01), Hazel
patent: 4528307 (1985-07-01), Fuhr et al.
patent: 4562488 (1986-01-01), Minami et al.
patent: 4588788 (1986-05-01), Nir et al.
patent: 4826896 (1989-05-01), Procter
Abstract No. 104: 6945z, "Thermally Conductive Electric Insulator for Mounting Solid-state Devices".
Abstract No. 105:25502q, "Potting Semiconductor Devices".
Abstract No. 103:216581h, "Prepress with High Thermal Conductivity".
Abstract No. 93:196556y, "Multilayer Printed Circuit Board".
Abstract No. 104:51603x, "Thermal Conductors".
Abstract No. 103:55201s, "Epoxy Resin Potting Compositions".
Abstract No. 103:55096m, "Epoxy Resin Composition for Cast Molding Electric Circuits".
Abstract No. 105:192579b, "Thermoconductive Adhesives".
Abstract No. 92:143265k, "Silicone Rubber Electric Insulators Having Good Thermal Conductivity".
Abstract No. 93:27563t, "Silicon Rubber Electric Insulators Having Good Thermal Conductivity".
Abstract No. 102:25938z, "Epoxy Resin Potting Compositions".
Latham Carol A.
McGuiggan Michael F.
Curatolo Joseph G.
Esposito Michael F.
Evans Larry W.
Hellender Karen A.
Marquis Melvyn I.
LandOfFree
Thermally conductive ceramic/polymer composites does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermally conductive ceramic/polymer composites, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally conductive ceramic/polymer composites will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-640773