Thermally conductive ceramic attachment

Details Thermally conductive ceramic attachment Thermally conductive ceramic attachment

1977-03-10

1978-08-29

Myhre, Charles J.

Heat exchange

Movable heating or cooling surface

Rotary drum

165 79, 165133, 165185, 165DIG7, 310 11, G05D 2300, F28F 1318, F28F 2100

Patent

active

041097068

ABSTRACT:
Copper backings brazed to ceramic parts exposed to high-temperature oxidizing high-velocity gases must be secured, for mounting purposes, to water-cooled fixed support, with high thermal conductance between backing and support. Prior art practice of brazing backing to support is inconvenient, making subsequent removal difficult, and disadvantageous in requiring that support be heated to brazing temperature (which may weaken support by annealing it). Invention teaches channel-shaped clip, on back of backing, whose legs are spread slightly to be inserted in mating slots in support face. All mating surfaces are tinned with lead-tin eutectic solder. If mere mechanical contact provides adequate thermal conductance between backing and support, solder remains unmelted; but if mechanical contact is imperfect temperature of backing will rise, and solder will melt and bridge gap between backing and support, raising thermal conductance.

REFERENCES:
patent: 789530 (1905-05-01), Fenn et al.
patent: 2363375 (1944-11-01), Wild
patent: 2512143 (1950-06-01), Dailey
patent: 3893161 (1975-07-01), Pesak, Jr.

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