Thermally conductive adhesive interface

Details Thermally conductive adhesive interface Thermally conductive adhesive interface

1995-07-25

1997-01-07

Bell, James J.

Electrical connectors

Including elastomeric or nonmetallic conductive portion

Adapted to be sandwiched between preformed panel circuit...

29829, 428283, 4283044, 4283066, 4283179, 428323, 428329, 428421, 428422, 428901, H01R 400

Patent

active

055910343

ABSTRACT:
A thermally conductive interface is provided suitable for thermal conduction, especially between electronic components. The preferred thermally conductive interface comprises an open structure fluoropolymer material, such as expanded polytetrafluoroethylene, with uncoated thermally conductive particles attached to solid portions thereof. The interface has numerous benefits over previously available material, such as improved thermal conductivity, high conformability, better compressibility, inherent porosity so as to provide air relief, improved stress relief, and high material compliance and resistance to fatigue during thermal cycling.

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