Thermally conducting materials and applications for microelectro

Details Thermally conducting materials and applications for microelectro Thermally conducting materials and applications for microelectro

1998-07-07

2000-09-05

Cain, Edward J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523205, C08K 900

Patent

active

061144134

ABSTRACT:
A conductive paste structure is is disclosed which is a combination of a polymeric material and particles, e.g. Cu, having a thermally conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic. The conductive paste structure is disposed between two thermally conductive surfaces, e.g.chip and substrate pads, to provide thermal interconnection and adhesion between their pads.

REFERENCES:
patent: 5288769 (1994-02-01), Papageorge et al.

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