Thermally conducting foam interface materials

Details Thermally conducting foam interface materials Thermally conducting foam interface materials

2003-05-30

2010-06-29

Vo, Hai (Department: 1794)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

C428S317300, C428S318400, C428S319300, C428S319700, C428S3550AC, C428S343000

Reexamination Certificate

active

07744991

ABSTRACT:
In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film.

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