Thermally balanced leadless microelectronic circuit chip carrier

Details Thermally balanced leadless microelectronic circuit chip carrier Thermally balanced leadless microelectronic circuit chip carrier

1980-08-22

1983-12-13

Wojciechowicz, Edward J.

357 69, 357 70, H01L 2302

Patent

active

044207670

ABSTRACT:
A thermally balanced leadless microelectronic circuit chip carrier in which the chip is mounted directly on a heat sinking member by means of a conductive stress relieving polyimide. The heat sinking member, which has a support surface for the chip and an extending threaded shaft, is held by a carrier member thermally compatible with the surface on which the package is to be used. The shaft passes through the carrier member and receiving surface to a heat sinking nut which holds the package to the receiving surface. Leads on the carrier member surface are used to connect the receiving surface to the wires bonded to the chip contacts.

REFERENCES:
patent: 3590328 (1971-06-01), Frescura et al.

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