Thermally and electrically conductive adhesive material and meth

Details Thermally and electrically conductive adhesive material and meth Thermally and electrically conductive adhesive material and meth

1993-03-29

1994-07-12

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural diverse bonding

22818022, 29830, 361779, 1562739, H01L 2158

Patent

active

053280873

ABSTRACT:
The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.

REFERENCES:
patent: 3141238 (1964-07-01), Herman, Jr.
patent: 3372310 (1968-03-01), Kanter
patent: 3395443 (1968-08-01), Polinko, Jr.
patent: 3805123 (1974-04-01), Rieger
patent: 4098452 (1978-07-01), Webster et al.
patent: 4233103 (1980-11-01), Shaheen
patent: 4299715 (1981-11-01), Whitfield et al.
patent: 4398975 (1983-08-01), Ohsawa et al.
patent: 4403410 (1983-09-01), Robinson
patent: 4410457 (1983-10-01), Fujimura et al.
patent: 4435611 (1984-03-01), Ohsawa et al.
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4448240 (1984-05-01), Sharon
patent: 4515304 (1985-05-01), Berger
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4611745 (1986-09-01), Nakahasi et al.
patent: 4732702 (1988-03-01), Yamazaki et al.
patent: 4740252 (1988-04-01), Hasegawa et al.
patent: 4740830 (1988-04-01), Ketley
patent: 4744850 (1988-05-01), Imano et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4769525 (1988-09-01), Leatham
patent: 4769690 (1988-09-01), Suzuki et al.
patent: 4796157 (1989-01-01), Ostrem
patent: 4804132 (1989-02-01), DiFrancesco
patent: 4875617 (1989-10-01), Citowsky
patent: 4929597 (1990-05-01), Takeshita et al.
patent: 4949220 (1990-08-01), Tashiro
patent: 4995546 (1991-02-01), Regnault
patent: 5019201 (1991-05-01), Yabu et al.
patent: 5024264 (1991-06-01), Natori et al.
patent: 5031308 (1991-07-01), Yamashita et al.
patent: 5053195 (1991-10-01), MacKay
patent: 5056706 (1991-10-01), Dolbear et al.
patent: 5062896 (1991-11-01), Huang et al.
patent: 5147210 (1992-09-01), Patterson et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5183969 (1993-02-01), Odashima
patent: 5225157 (1993-07-01), McKay
patent: 5235741 (1993-08-01), Mase
patent: 5258577 (1993-11-01), Clements
"IBM Technical Disclosure Bulletin" vol. 31, No. 5, Oct. 1988, pp. 34-35.
Hansen, Constitution of Binary Alloys, McGraw-Hill, 1958, p. 22 & 96.
Keeler, "Liquid Interconnects For Fine Pitch Assembly?" Electronic Packaging & Production, vol. 14, Jun. 1989 pp. 14-15.
Glushkova et al., "Gallium-Copper and Gallium-Nickel Paste Solders," Svar. Proiz., No. 11, 1968, pp. 36-37.
Tikhomirova, et al., "Soldering Copper with Copper-Gallium Solders," Svar. Proiz., No. 10, 1967, pp. 16-18.
Harman, "Hard Gallium Alloys for Use as Low Contact Resistance Electrodes and for Bonding Thermocouples into Samples," The Review of Scientific Instruments, vol. 31, No. 7, Jul. 1960, pp. 717-720.
Tikhomirova, et al., "Effect of the Particle Shape and Size of a Second Component on the Properties of the Gallium Solders," Poroshkovaya Metallurgiya, No. 12 (84), Dec. 1969, pp. 51-56.
Darveaux et al., "Thermal/Stress Analysis of a Multichip Package Design," Proceedings of the 39th Electronic Components Conference, 1989, pp. 668-671.
Nayak et al., "A High Performance Thermal Module for Computer Packaging," Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 357-364.
Hwang et al., "A Thermal Module Design for Advanced Packaging," Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 347-355.
Product Brochure entitled "INDALLOY.TM. Fusible Alloys Available" by Indium Corporation of America, Utica, N.Y. (date unknown) pp. 1-5.
Product Brochure entitled "Z link.TM. Multilayer Technology" by Sheldahl, Inc., Northfield, Minn., (date unknown) pp. 1-8.
Technical Bulletin entitled "DieGlas.TM. Die Attach Material Processing Recommendations" by Alphametals, Jersey City, N.J., Feb. 1992, pp. 1-2.
Product Brochure entitled "High Performance Electronic Materials Manufactured by A. I. Technology, Inc." by A. I. Technology, Inc., Princeton, N.J. (date unknown) pp. 1-5.
P. Bujard, "Thermal Conductivity of Boron Nitride Filled Epoxy Resins: Temperature Dependence Influence of Sample Penetration", Intersociety Conference on THERMAL Performance in the Fabrication and Operation of Electronic Components 1988, Los Angeles, Calif., May 11-13, 1988, pp. 41-49.
Thomas Dolbear, "Liquid Metal Paste for Thermal Connections", Proceedings of the International Electronic Packaging Society (IEPS), Sep., 1992, pp. 475-485.

Affiliated with

Also associated with

Rating

Thermally and electrically conductive adhesive material and meth does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally and electrically conductive adhesive material and meth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally and electrically conductive adhesive material and meth will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-391010