Thermally activated noise immune fuse

Details Thermally activated noise immune fuse Thermally activated noise immune fuse

1994-08-10

1995-08-22

Meier, Stephen D.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Temperature

257530, H01L 29167, H01L 2348, H01L 29207

Patent

active

054442877

ABSTRACT:
A noise immune fuse having sub-micron dimensions which can be programmed by an electrically and thermally synchronized event. The fuse includes a pair of fuse links in close proximity of each other, a layer of thermally conductive and electrically insulating material thermally coupling the two links forming the pair, and means for programming the first link by prompting the second link to gate the energy transfer between the links via the coupling layer. By combining thermal and electrical pulses to perform the programming function, the reliability of the fuse structure is greatly enhanced when compared to that of a single element fuse.

REFERENCES:
patent: 4752118 (1985-06-01), Johnson
patent: 4774561 (1988-09-01), Takagi
patent: 4984054 (1991-01-01), Yamada et al.
patent: 5049969 (1991-09-01), Orbach et al.
patent: 5084691 (1992-01-01), Lester et al.
patent: 5196724 (1993-03-01), Gordon et al.

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