Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-06-14
2011-06-14
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000, C257SE23080
Reexamination Certificate
active
07960827
ABSTRACT:
A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.
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paten
Dreiza Mahmoud
Miks Jeffrey A.
Miller, Jr. August J.
Scanlan Christopher M.
Amkor Technology Inc.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
Potter Roy K
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