Thermal-type flow rate sensor and manufacturing method thereof

Details Thermal-type flow rate sensor and manufacturing method thereof Thermal-type flow rate sensor and manufacturing method thereof

2007-05-22

2007-05-22

Patel, Harshad (Department: 2855)

Measuring and testing

Volume or rate of flow

Thermal type

Reexamination Certificate

active

11178306

ABSTRACT:
In a thermal-type flow rate sensor, a mold material is formed to integrally cover a predetermined range including a circuit chip, connecting parts of connecting wires with a flow rate detecting chip and the circuit chip, and connecting parts of connecting wires with the circuit chip and a lead portion, to expose a part of the flow rate detecting chip to a measured fluid. The flow rate detecting chip is located in a groove portion of a support member to have a clearance with the groove portion and to form a cavity part inside a thin wall portion of the detecting chip. The cavity part communicates with an outside through a communicating portion that includes the clearance, and the clearance is blocked by a filler at least at a portion positioned in the predetermined range. Therefore, the filler prevents the mold material from entering the clearance in the mold forming.

REFERENCES:
patent: 5396795 (1995-03-01), Araki
patent: 6708560 (2004-03-01), Watanabe et al.
patent: B2-3228547 (1999-01-01), None
Notice of Preliminary Rejection from Korean Patent Office issued on Sep. 29, 2006 for the corresponding Korean patent application No. 10-2005-0067491 (a copy and English translation thereof).

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