Semiconductor device manufacturing: process – Gettering of substrate
Reexamination Certificate
2011-04-12
2011-04-12
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Gettering of substrate
C438S473000, C438S476000, C438S488000, C257SE21133, C257SE21347
Reexamination Certificate
active
07923352
ABSTRACT:
The invention provides a method for activating impurity element added to a semiconductor and performing gettering process in shirt time, and a thermal treatment equipment enabling to perform such the heat-treating. The thermal treatment equipment comprises treatment rooms of n pieces (n>2) performing heat-treating, a preparatory heating room, and a cooling room, and heating a substrate using gas heated by heating units of n pieces as a heating source, wherein a gas-supplying unit is connected to a gas charge port of the cooling room, a discharge port of the cooling room is connected to a first gas-heating unit through a heat exchanger, a charge port of an m-th (1≦m≦(n−1)) treatment room is connected to a discharge port of an m-th gas-heating unit, a charge port of an n-th treatment room is connected to a discharge port of an n-th gas-heating unit, a discharge port of the n-th treatment room is connected to the heat exchanger, and discharge port of the heat exchanger is connected to gas charge port of the preparatory heating room.
REFERENCES:
patent: 5587330 (1996-12-01), Yamazaki
patent: 5893730 (1999-04-01), Yamazaki et al.
patent: 5997286 (1999-12-01), Hemsath et al.
patent: 6013544 (2000-01-01), Makita et al.
patent: 6059567 (2000-05-01), Bolton et al.
patent: 6133073 (2000-10-01), Yamazaki et al.
patent: 6140667 (2000-10-01), Yamazaki et al.
patent: 6204194 (2001-03-01), Takagi
patent: 6291275 (2001-09-01), Yamazaki et al.
patent: 6310327 (2001-10-01), Moore et al.
patent: 6337259 (2002-01-01), Ueda et al.
patent: 6348368 (2002-02-01), Yamazaki et al.
patent: 6399454 (2002-06-01), Yamazaki
patent: 6427462 (2002-08-01), Suenaga et al.
patent: 6436745 (2002-08-01), Gotou et al.
patent: 6458637 (2002-10-01), Yamazaki et al.
patent: 6474986 (2002-11-01), Oda et al.
patent: 6512206 (2003-01-01), McEntire et al.
patent: 6605497 (2003-08-01), Yamazaki et al.
patent: 6825072 (2004-11-01), Yamazaki et al.
patent: 6890805 (2005-05-01), Yamazaki et al.
patent: 6962837 (2005-11-01), Yamazaki
patent: 7022589 (2006-04-01), Yamazaki
patent: 7118780 (2006-10-01), Yamazaki et al.
patent: 7129120 (2006-10-01), Yamazaki
patent: 7166500 (2007-01-01), Yamazaki et al.
patent: 2002/0000242 (2002-01-01), Matushiita et al.
patent: 2002/0034863 (2002-03-01), Yamazaki et al.
patent: 2002/0040981 (2002-04-01), Yamazaki et al.
patent: 2002/0090765 (2002-07-01), Yamazaki et al.
patent: 2002/0134530 (2002-09-01), Giacobbe
patent: 2002/0179283 (2002-12-01), Suenaga et al.
patent: 2003/0211669 (2003-11-01), Yamazaki et al.
patent: 2005/0095760 (2005-05-01), Yamazaki et al.
patent: 2005/0189592 (2005-09-01), Yamazaki et al.
patent: 2008/0311286 (2008-12-01), Yamazaki
patent: 0 936 662 (1999-08-01), None
patent: 63-46380 (1988-02-01), None
patent: 63-197343 (1988-08-01), None
patent: 3-76227 (1991-04-01), None
patent: 3-102818 (1991-04-01), None
patent: 4-44314 (1992-02-01), None
patent: 4-337628 (1992-11-01), None
patent: 5-206044 (1993-08-01), None
patent: 5-299364 (1993-11-01), None
patent: 6-151414 (1994-05-01), None
patent: 8-213635 (1996-08-01), None
patent: 10-55951 (1998-02-01), None
patent: 10-229078 (1998-08-01), None
patent: 11-31660 (1999-02-01), None
patent: 11-204535 (1999-07-01), None
patent: 11-260728 (1999-09-01), None
patent: 2000-3918 (2000-01-01), None
patent: 2000-105081 (2000-04-01), None
patent: 2000-133606 (2000-05-01), None
patent: 2001-135573 (2001-05-01), None
patent: 2002-289518 (2002-10-01), None
patent: 1997-0063762 (1997-09-01), None
patent: 1999-016246 (1999-03-01), None
patent: 1999-0037169 (1999-05-01), None
patent: 1999-0037250 (1999-05-01), None
patent: 1999-0053882 (1999-07-01), None
patent: 10-0220207 (1999-09-01), None
patent: 1999-0072527 (1999-09-01), None
patent: 2002-0091313 (2002-12-01), None
patent: 2008-0056404 (2008-07-01), None
U.S. Appl. No. 10/098,688 (pending) to Yamazaki et al, filed Mar. 15, 2002 including specification, abstract, claims, drawings and PTO filing receipt.
Office Action re Korean Patent Application No. KR 2008-0056404, dated Jul. 25, 2008 (with English translation).
Ghyka Alexander G
Husch & Blackwell LLP
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Thermal treatment equipment and method for heat-treating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal treatment equipment and method for heat-treating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal treatment equipment and method for heat-treating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2720266