Thermal treatment apparatus, method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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C257S635000, C257SE23001

Reexamination Certificate

active

07667301

ABSTRACT:
A thermal treatment apparatus, a method for manufacturing a semiconductor device, and a method for manufacturing a substrate, wherein the occurrence of slip dislocation in a substrate during heat treatment is reduced, and a high-quality semiconductor device can be manufactured, are intended to be provided.A substrate support30is formed from a main body portion56and a supporting portion58. In the main body portion56, a plurality of placing portions66extend parallel, and supporting portions58are provided on the placing portions66. A substrate68is placed on the supporting portion58. The supporting portion58has a smaller area than an area of a flat face of the substrate, and is formed from a silicon plate having a thickness larger than thickness of the substrate, so that deformation during heat treatment is reduced. The supporting portion58is made of silicon, and a layer coated with silicon carbide (SiC) is formed on a substrate-placing face of the supporting portion58.

REFERENCES:
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patent: 07-161654 (1995-06-01), None
patent: 09-260470 (1997-10-01), None
patent: 10-242067 (1998-09-01), None
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patent: 11-340155 (1999-12-01), None
patent: 2001-358086 (2001-12-01), None
patent: 2002-231726 (2002-08-01), None
patent: A-2002-033284 (2009-06-01), None
patent: 97-53476 (1997-07-01), None

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