Thermal transport structure and associated method

Details Thermal transport structure and associated method Thermal transport structure and associated method

2007-11-20

2007-11-20

Chaney, Carol (Department: 1773)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

C428S408000, C428S411100, C361S704000

Reexamination Certificate

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11247114

ABSTRACT:
A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.

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Co-pending application entitled “Thermal Management System and Associated Method”, filed on Oct. 11, 2005.

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