Thermal transfer posts for high density multichip substrates and

Details Thermal transfer posts for high density multichip substrates and Thermal transfer posts for high density multichip substrates and

1991-12-19

1993-05-25

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437180, 437195, 437211, H01L 2160

Patent

active

052140008

ABSTRACT:
Thermal post vias are formed within a formed multi-layer, high density interconnect including a base and plural layers of metal conductors separated by dielectric material by the steps of:

REFERENCES:
patent: 4803450 (1989-02-01), Burgess et al.
patent: 5043297 (1991-08-01), Suzuki et al.
patent: 5048166 (1991-09-01), Wakamatsu
patent: 5063175 (1991-11-01), Broadbent
patent: 5102829 (1992-04-01), Cohn
patent: 5106461 (1992-04-01), Volfson et al.
Keeley et al., "Achieveing a Balance of Thermal Performance and Routing Density in a Multichip Module Substrate," Proc. Techn. Prog. Nat. Electron. Packaging & Production Conf. (NEPCON-East 1991), pp. 551-561 (Cahners Exposition Group, Des Plaines, Ill., 1991).
Advance Packaging Systems brochure entitled "Reliability Report-High Density Interconnect Multichip Module Substrates" pp. 1-16 date unknown.

Affiliated with

Also associated with

Rating

Thermal transfer posts for high density multichip substrates and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal transfer posts for high density multichip substrates and, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal transfer posts for high density multichip substrates and will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-897127