Thermal transfer medium and method of making thereof

Details Thermal transfer medium and method of making thereof Thermal transfer medium and method of making thereof

2007-10-16

2007-10-16

Hess, Bruce H. (Department: 1774)

Stock material or miscellaneous articles

Thermal transfer donor

Specialized non-transferable layer on support

C428S032820

Reexamination Certificate

active

10834163

ABSTRACT:
The present invention relates to a thermal transfer medium which transfers images to a receiving substrate. The thermal transfer medium includes a laminate, having a substrate, a coating and a functional layer positioned substantially on the coating. This coating may include an oil. Furthermore, the present invention also relates to a method of making the thermal transfer medium.

REFERENCES:
patent: 4707406 (1987-11-01), Inaba et al.
patent: 5045383 (1991-09-01), Maeda et al.
patent: 5407724 (1995-04-01), Mimura et al.
patent: 5501937 (1996-03-01), Matsumoto et al.
patent: 5627127 (1997-05-01), Hiroi et al.
patent: 5744226 (1998-04-01), Olmstead et al.
patent: 5767044 (1998-06-01), Bigelow et al.
patent: 5856269 (1999-01-01), Hayashi et al.
patent: 5880065 (1999-03-01), Hayashi et al.
patent: 6057028 (2000-05-01), Tan et al.
patent: 6077594 (2000-06-01), Roth
patent: 6207268 (2001-03-01), Kosaka et al.
patent: 6254943 (2001-07-01), Osbourne
patent: 6291062 (2001-09-01), Oshima et al.
patent: 6309696 (2001-10-01), Mochizuki et al.
patent: 6383621 (2002-05-01), Tojima et al.
patent: 6468634 (2002-10-01), Miyake et al.

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