Thermal transfer material and thermal transfer recording method

Details Thermal transfer material and thermal transfer recording method Thermal transfer material and thermal transfer recording method

1992-08-25

1993-12-14

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156235, 156240, 156241, 156277, 400695, 400120, 428913, B32B 3100, B41J 2900

Patent

active

052698661

ABSTRACT:
A thermal transfer material comprising at least a support, a first ink layer, a second ink layer, a third ink layer and a fourth ink layer disposed in this order on the support, wherein the first ink layer predominantly comprises a water-soluble polyester resin, the second ink layer is capable of causing separation from the first ink layer on heating, and third and fourth ink layers predominantly comprises a thermoplastic resin.

REFERENCES:
patent: 4235657 (1980-11-01), Greenman et al.
patent: 4396308 (1983-08-01), Applegate et al.
patent: 4453839 (1984-06-01), Findlay et al.
patent: 4684271 (1987-08-01), Wellman et al.
patent: 4687360 (1987-08-01), Wellman et al.
patent: 4739338 (1988-04-01), Tanaka et al.
patent: 4748151 (1988-05-01), Murata et al.
patent: 4834567 (1989-05-01), Ueno
patent: 4875961 (1989-10-01), Oike et al.
patent: 5120383 (1992-06-01), Takei et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 6, p. 3198 (Nov. 1984).
Patent Abstracts of Japan, vol. 11, No. 128 (M-583) (25-75) Apr. 22, 1987.
Patent Abstracts of Japan, vol. 12, No. 121 (M-686) (2968), Apr. 15, 1988.
Patent Abstracts of Japan, vol. 12, No. 352 (M-744), Sep. 21, 1988.

Affiliated with

Also associated with

Rating

Thermal transfer material and thermal transfer recording method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal transfer material and thermal transfer recording method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal transfer material and thermal transfer recording method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1701882