Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-02
2007-10-02
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C361S701000, C361S709000, C165S080300, C165S080400, C165S104330
Reexamination Certificate
active
11199681
ABSTRACT:
A thermal conducting device removes heat from a power dissipating device installed within a case, and includes a base coupled to the power dissipating device and a translational portion that is movable in a vertical dimension. The translational portion couples at an upper surface to the inner surface of the case panel. A cavity and piston in the base and the translating portion may provide complementary guide surfaces to constrain movement of the translational portion generally to a vertical dimension. A biasing element may urge the translational portion upward. The translational portion and the external panel may allow movement of their respective surfaces relative to one another. The cavity may include a port allowing air to pass into and out of the cavity. The upper surface of the translational portion may be tiltable with respect to the base. An adhesive layer may couple the base and the power dissipating device.
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The Article: “Water-Cooled Circuit Module With Grooves Forming Passages Ner Heat-Producing Devices” IBM Technical Disclosure Bulletin, May 1989,□□US vol. 31; Issue 12; pp. 49-50.
The Article: “Enhanced Thermal Conduction Piston” IBM Technical Disclosure Bulletin, US vol. 24; Issue 12; pp. 6453-6454.
Chang Simon
Gooch Donn D.
Ross Daniel T.
Datskovskiy Michael
Kolisch & Hartwell, P.C.
Verifone Holdings, Inc.
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