Thermal testing method for integrated circuit chips and...

Details Thermal testing method for integrated circuit chips and... Thermal testing method for integrated circuit chips and...

2005-09-20

2005-09-20

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S760020

Reexamination Certificate

active

06946856

ABSTRACT:
A method of thermally testing for whether an integrated circuit die is attached to a die pad, is provided. Heat is applied from an external heat source to a first side of the die pad. The die is attached to a second side of the die pad. The second side of the die pad is opposite the first side of the die pad. A temperature of the die is measured at a first die location on the die. The die pad is located between the external heat source and the first die location. This method may be performed using a thermal test apparatus having a socket and the external heat source. The socket is adapted to receive and retain one or more leads of a die package. The apparatus may further include a mechanism adapted to move the heat source toward the first side of the die pad.

REFERENCES:
patent: 5521511 (1996-05-01), Lanzi et al.
patent: 6294923 (2001-09-01), Blish et al.
patent: 6415975 (2002-07-01), Vijchulata et al.
patent: 6531336 (2003-03-01), Mikami
patent: 6774466 (2004-08-01), Kajiwara et al.

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