Thermal testing apparatus and method

Details Thermal testing apparatus and method Thermal testing apparatus and method

1995-08-30

1998-02-03

Chilcot, Richard

Thermal measuring and testing

Temperature measurement

In spaced noncontact relationship to specimen

374121, G01J 500, G01J 554

Patent

active

057136661

ABSTRACT:
A method and apparatus for measuring thermal properties of electronic components (25) encapsulated in packaging is described. The method can be used to measure a junction temperature T.sub.j of the electronic component (25), without removing the package (30), and during operation of the electronic component (25) by a power supply. The method comprises the steps of (a) positioning the electronic component (25) in a field of view of an infrared sensor (90), during operation of the electronic component (25) by the power supply; (b) focusing the infrared sensor (90) on the electronic component (25) inside the package (30) to obtain (i) a sharp outline of the component, and (ii) a maximum temperature reading; (c) removing the electronic component (25) from the field of view of the infrared sensor (90); (d) positioning a blackbody source (65) capable of emitting infrared radiation at different wavelengths at substantially the same focal point as the electronic component (25); (e) calibrating the infrared sensor (90) using the blackbody source (65); (f) replacing the blackbody source (65) by the electronic component (25) while continuing to operate the electronic component (25) by the power supply; (g) adjusting the focus of the calibrated infrared sensor (90) by an amount F.sub.c sufficient to compensate for a thermal expansion movement of the electronic component (25) and package (30) caused by a rise in temperature of the electronic component (25) resulting from operation of the component by the power supply; and (h) measuring the junction temperature T.sub.j of the electronic component (25) to an accuracy of greater than 5% without removing the package (30) of the electronic component (25).

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"Device Thermal Resistance Measurement by IR Scanning" MSC, Jan. 1977, pp. 1-6.
"Analysis Tech" brochure--Wakefield, Massachusetts.

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