Thermal technique for simultaneous testing of circuit board sold

Details Thermal technique for simultaneous testing of circuit board sold Thermal technique for simultaneous testing of circuit board sold

1987-01-16

1988-12-20

Howell, Janice A.

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

250334, G01N 2171, G01N 2572

Patent

active

047926830

ABSTRACT:
A system for inspecting the electronic integrity of solder joints by repetitive pulse-heating the solder joints with radiant energy and determining the temperature oscillation of pulse-heated solder joints by measuring the infrared emissions from the solder joints during heating and non-heating periods. Advantageously, the exposed solder joints of a circuit board can be tested all at one time by pulse-heating the entire circuit board. The temperature oscillation of each joint can be compared to the temperature oscillations of corresponding standard solder joints of known good electronic integrity on properly operating boards.

REFERENCES:
patent: 3808439 (1974-04-01), Renius
patent: 4240750 (1980-12-01), Kurtz et al.
patent: 4481418 (1984-11-01), Vanzetti et al.
patent: 4647220 (1987-03-01), Adams et al.
R. W. Jones and L. M. White, "Infrared Evaluation of Multilayer Boards", Materials Evaluation, (Feb. 1969) pp. 37-41.

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